{"id":5831,"date":"2026-05-29T19:01:52","date_gmt":"2026-05-29T11:01:52","guid":{"rendered":"..\/..\/..\/..\/index.html\/?post_type=cxb_products&#038;p=5831"},"modified":"2026-06-05T15:38:05","modified_gmt":"2026-06-05T07:38:05","slug":"lightweight-aluminum-diamond-al-diamond-heat-sinks","status":"publish","type":"cxb_products","link":"..\/..\/..\/..\/index.html\/products\/lightweight-aluminum-diamond-al-diamond-heat-sinks\/","title":{"rendered":"Lightweight Aluminum Diamond (Al\/Diamond) Heat Sinks"},"content":{"rendered":"<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"941\" height=\"391\" src=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/lightweight-high-thermal-conductivity-aluminum-diamond_02.jpg\" alt=\"| UKing Diamond\" class=\"wp-image-5834\" title=\"- UKing Diamond\" srcset=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/lightweight-high-thermal-conductivity-aluminum-diamond_02.jpg 941w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/lightweight-high-thermal-conductivity-aluminum-diamond_02-300x125.jpg 300w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/lightweight-high-thermal-conductivity-aluminum-diamond_02-768x319.jpg 768w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/lightweight-high-thermal-conductivity-aluminum-diamond_02-18x7.jpg 18w\" sizes=\"(max-width: 941px) 100vw, 941px\" \/><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\">Uking Diamond&#8217;s Aluminum Diamond (Al\/Diamond) materials represent the pinnacle of <strong>lightweight thermal engineering<\/strong>. By high-pressure infiltrating molten aluminum alloy into a dense synthetic diamond skeleton, we produce customized components that exhibit high structural stability and excellent machine ability:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Aerospace &amp; Satellite Electronics:<\/strong>&nbsp;Delivers mission-critical cooling for payload transponders and radar systems where every gram of weight reduction drastically lowers launch costs.<\/li>\n\n\n\n<li><strong>5G\/6G Macro Base Stations:<\/strong>&nbsp;Serves as high-efficiency thermal spreaders for remote radio heads (RRH) and MIMO antenna arrays, enduring harsh outdoor environmental swings.<\/li>\n\n\n\n<li><strong>Automotive Power Inverters:<\/strong>&nbsp;Protects IGBT and SiC power modules in electric vehicle drive trains from high-temperature failures under aggressive acceleration cycles.<\/li>\n\n\n\n<li><strong>High-Speed Optoelectronics &amp; Transceivers:<\/strong>&nbsp;Provides laser-flat, low-expansion mounting sub mounts for 400G\/800G optical communication chips.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Technical Specifications<\/strong><strong><\/strong><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Physical &amp; Engineering Property<\/strong><\/td><td><strong>Technical Specification Standard<\/strong><\/td><\/tr><tr><td><strong>Material Matrix Architecture<\/strong><\/td><td>Premium Aluminum\/Alloy Matrix (Al) + High-Purity Diamond Grids<\/td><\/tr><tr><td><strong>Thermal Conductivity<\/strong><\/td><td>400&nbsp;\u2013&nbsp;950&nbsp;W\/m\u22c5K<em>&nbsp;(Exceeds pure copper with 1\/3 of the weight)<\/em><\/td><\/tr><tr><td><strong>Coefficient of Thermal Expansion<\/strong><\/td><td>11.6\u00d710\u22126&nbsp;\/K&nbsp;to&nbsp;6.5\u00d710\u22126&nbsp;\/K (Tailored to match GaN &amp; Si)<\/td><\/tr><tr><td><strong>Material Density<\/strong><\/td><td>3.1&nbsp;\u2013&nbsp;3.5&nbsp;g\/cm3 (Ultimate weight-saving thermal solution)<\/td><\/tr><tr><td><strong>Flexural Strength<\/strong><\/td><td>\u2265400&nbsp;MPa (Preserves initial strength up to 500\u2218C environmental limits)<\/td><\/tr><tr><td><strong>Dimensional Length\/Width Tolerance<\/strong><\/td><td>\u00b10.05&nbsp;mm (High-precision near-net shape capability)<\/td><\/tr><tr><td><strong>Thickness Range Limits<\/strong><\/td><td>0.5&nbsp;mm&nbsp;\u2013&nbsp;1.0&nbsp;mm (Customizable thinner profiles available)<\/td><\/tr><tr><td><strong>Machining Profile Tolerance<\/strong><\/td><td>\u00b130&nbsp;\u03bcm (Ensures perfect alignment in automated pick-and-place lines)<\/td><\/tr><tr><td><strong>Surface Roughness<\/strong><\/td><td>&lt;2&nbsp;\u03bcm (Optimized for Ni\/Au electroplating and advanced soldering)<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Product Details<\/strong><strong><\/strong><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>The Ultimate Weight-to-Performance Ratio for Aerospace<\/strong><\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">In advanced aerospace and mobile defense systems, using heavy copper heat sinks is a liability. Uking\u2019s <strong>Aluminum Diamond composites<\/strong>&nbsp;change the game.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Boasting a density of just 3.1&nbsp;\u2013&nbsp;3.5&nbsp;g\/cm3 (virtually identical to standard aluminum but with a thermal conductivity up to 950&nbsp;W\/m\u22c5K), these plates allow system architects to maximize continuous RF power output without exceeding the critical payload mass restrictions.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Thermal Shock Immunity &amp; High Temperature Survival<\/strong><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Electronic systems utilizing GaN or silicon devices often face harsh thermal cycles. Our Al\/Diamond plates are engineered to withstand these extreme conditions with superior stability:<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">-Exceptional Thermal Stability: Maintains over 90% of initial flexural strength even at continuous operating temperatures up to 500\u00b0C.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">-Superior Internal Integrity: Utilizes precise vacuum pressure metallurgical processing to effectively prevent voids and catalyst pooling (e.g., cobalt) at internal boundaries.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">-Tailored CTE Matching: Features an engineered low Coefficient of Thermal Expansion (6.5\u201311.6 ppm\/K) that aligns perfectly with semiconductor die expansion curves. This prevents micro-delamination, solder cracking, and sudden module failure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Key Features &amp; Value Drivers<\/strong><strong><\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Ultra-Lightweight Thermal Defense:<\/strong>&nbsp;Delivers copper-grade thermal throughput at one-third of the weight, maximizing payload efficiency. <em><\/em><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Tailored Low Thermal Expansion: <\/strong>Seamlessly scales from 6.5 to 11.6 ppm\/K via structural composition tweaks, eliminating mechanical packaging fatigue.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Extreme Thermal Stability:<\/strong><strong>&nbsp;<\/strong>Retains high structural integrity and rigid strength under 500\u00b0C high-stress environments.<\/li>\n\n\n\n<li><strong>High Complex Shape Adaptation:<\/strong><strong>&nbsp;<\/strong>Easily mass-manufactured into custom complex geometries with counterbores and multi-level steps according to your drawings.<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img decoding=\"async\" width=\"2560\" height=\"700\" data-src=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Lightweight-Aluminum-Diamond-scaled.png\" alt=\"| UKing Diamond\" class=\"wp-image-6322 lazyload\" style=\"--smush-placeholder-width: 2560px; --smush-placeholder-aspect-ratio: 2560\/700;width:1455px;height:auto\" title=\"- UKing Diamond\" data-srcset=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Lightweight-Aluminum-Diamond-scaled.png 2560w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Lightweight-Aluminum-Diamond-300x82.png 300w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Lightweight-Aluminum-Diamond-1024x280.png 1024w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Lightweight-Aluminum-Diamond-768x210.png 768w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Lightweight-Aluminum-Diamond-1536x420.png 1536w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Lightweight-Aluminum-Diamond-2048x560.png 2048w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Lightweight-Aluminum-Diamond-18x5.png 18w\" data-sizes=\"(max-width: 2560px) 100vw, 2560px\" src=\"data:image\/gif;base64,R0lGODlhAQABAAAAACH5BAEKAAEALAAAAAABAAEAAAICTAEAOw==\" \/><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\"><strong>Are your aerospace transponders or high-frequency 5G modules bottlenecked by the extreme weight of copper heat sinks or catastrophic CTE cracking?<\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Stop compromising your mobile electronics with heavy, outdated thermal spreaders. Backed by 20 years of advanced metal-matrix composite (MMC) synthesis expertise in Henan, China, <strong>Uking Diamond<\/strong>&nbsp;delivers ultra-lightweight Aluminum Diamond heat sinks that elevate system reliability.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Because every Al\/Diamond plate requires high-purity diamond lattices processed under strict vacuum-pressure infiltration controls, we do not distribute unchecked free samples. We focus entirely on high-intent industrial evaluation.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Ready to cut weight and maximize your ROP? Contact our engineering team today with your target standard specifications (Length, Width, Thickness) and configuration limits.<\/strong>&nbsp;We will instantly open your <strong>Corporate Evaluation Pass<\/strong>: obtain your prioritized evaluation trial batch of standard Al\/Diamond plates at direct factory wholesale pricing, with <strong>100% of the sample evaluation cost fully credited back to your account upon your first bulk commercial order<\/strong>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>UKing Diamond\u2019s factory-direct Al\/Diamond metal matrix composites (MMC) combine isotropic thermal conductivity of 400\u2013950 W\/m\u00b7K with ultra-low density, providing an ideal lightweight thermal management solution for aerospace electronics, defense systems, GaN power devices, and advanced semiconductor packaging.<\/p>\n","protected":false},"featured_media":5832,"menu_order":0,"template":"","cxb_product_category":[17],"cxb_product_tag":[],"class_list":["post-5831","cxb_products","type-cxb_products","status-publish","has-post-thumbnail","hentry","cxb_product_category-diamond-aluminum-composite"],"_links":{"self":[{"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_products\/5831","targetHints":{"allow":["GET"]}}],"collection":[{"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_products"}],"about":[{"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/types\/cxb_products"}],"version-history":[{"count":6,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_products\/5831\/revisions"}],"predecessor-version":[{"id":6325,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_products\/5831\/revisions\/6325"}],"wp:featuredmedia":[{"embeddable":true,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/media\/5832"}],"wp:attachment":[{"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/media?parent=5831"}],"wp:term":[{"taxonomy":"cxb_product_category","embeddable":true,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_product_category?post=5831"},{"taxonomy":"cxb_product_tag","embeddable":true,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_product_tag?post=5831"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}