{"id":5821,"date":"2026-05-29T18:57:26","date_gmt":"2026-05-29T10:57:26","guid":{"rendered":"..\/..\/..\/..\/index.html\/?post_type=cxb_products&#038;p=5821"},"modified":"2026-06-05T15:35:21","modified_gmt":"2026-06-05T07:35:21","slug":"copper-diamond-cu-diamond-heat-sink-materials","status":"publish","type":"cxb_products","link":"..\/..\/..\/..\/index.html\/products\/copper-diamond-cu-diamond-heat-sink-materials\/","title":{"rendered":"Copper Diamond (Cu\/Diamond) Heat Sink Materials"},"content":{"rendered":"<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"941\" height=\"386\" src=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/high-thermal-conductivity-copper-diamond_02.jpg\" alt=\"| UKing Diamond\" class=\"wp-image-5825\" title=\"- UKing Diamond\" srcset=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/high-thermal-conductivity-copper-diamond_02.jpg 941w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/high-thermal-conductivity-copper-diamond_02-300x123.jpg 300w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/high-thermal-conductivity-copper-diamond_02-768x315.jpg 768w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/high-thermal-conductivity-copper-diamond_02-18x7.jpg 18w\" sizes=\"(max-width: 941px) 100vw, 941px\" \/><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\">Uking Diamond&#8217;s Copper Diamond (Cu\/Diamond) composite materials are premier metal-matrix thermal solutions. Unlike brittle pure diamond plates, these composites can be pressed into <strong>near-net shapes<\/strong>&nbsp;or machined into complex profiles, making them highly adaptive for multi-component surface metallization and advanced brazing\/soldering lines:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>High-Power Semiconductor Lasers:<\/strong>&nbsp;Serves as submounts for high-wattage laser diodes and laser bars, effectively relieving localized heat localization.<\/li>\n\n\n\n<li><strong>Radar TR Modules &amp; Electronic Countermeasures:<\/strong>&nbsp;Provides mass-producible, vibration-resistant thermal baseplates for military and commercial radar systems.<\/li>\n\n\n\n<li><strong>Aerospace Thermal Management:<\/strong>&nbsp;Delivers robust, radiation-immune heat dissipation brackets for deep-space communication hardware.<\/li>\n\n\n\n<li><strong>IGBT &amp; Power Electronic Modules:<\/strong>&nbsp;Acts as the critical interface material in electric vehicles and high-voltage traction inverters to prevent severe thermal cycling fatigue.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Technical Specifications<\/strong><strong><\/strong><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Physical &amp; Mechanical Parameters<\/strong><\/td><td><strong>Typical Technical Control Value<\/strong><\/td><\/tr><tr><td><strong>Material Base Architecture<\/strong><\/td><td>Copper Matrix (Cu) + Premium Synthetic Diamond Grids<\/td><\/tr><tr><td><strong>Thermal Conductivity<\/strong><\/td><td>500&nbsp;\u2013&nbsp;1000&nbsp;W\/m\u22c5K (2x to 2.5x higher than pure copper<\/td><\/tr><tr><td><strong>Coefficient of Thermal Expansion<\/strong><\/td><td>8.2\u00d710\u22126&nbsp;\/K (8.2&nbsp;ppm\/K) (Perfectly matches GaN\/SiC chips)<\/td><\/tr><tr><td><strong>Flexural Strength<\/strong><\/td><td>\u2265400&nbsp;MPa (High mechanical robustness against structural shock)<\/td><\/tr><tr><td><strong>Material Density<\/strong><\/td><td>6.1&nbsp;g\/cm3 (Optimized lightweight profiling compared to pure copper)<\/td><\/tr><tr><td><strong>Dimensional Length\/Width Tolerance<\/strong><\/td><td>\u00b10.05&nbsp;mm (High precision CNC machining capability)<\/td><\/tr><tr><td><strong>Thickness Customization Range<\/strong><\/td><td>0.5&nbsp;mm&nbsp;\u2013&nbsp;1.0&nbsp;mm (Standard micro-plate profiles)<\/td><\/tr><tr><td><strong>Machining Tolerance<\/strong><\/td><td>\u00b130&nbsp;\u03bcm (Ensures high-precision component alignment)<\/td><\/tr><tr><td><strong>Surface Roughness<\/strong><\/td><td>&lt;1&nbsp;\u03bcm (Laser-flat surface for superior die-attach bonding)<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h6 class=\"wp-block-heading has-text-align-center\">DIMENSIONS &amp; SURFACE FINISH<\/h6>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><br><strong>Available Forms<\/strong><br><br><strong>\u00b7<\/strong> Plate,bar,customized shapes<br><br><strong>\u00b7<\/strong> Hole, slot, notch processing available<br><br><strong>\u00b7<\/strong> Surface metalization and bonding treatment available<\/td><td class=\"has-text-align-center\" data-align=\"center\"><br><img decoding=\"async\" width=\"400\" height=\"164\" class=\"wp-image-6318 lazyload\" style=\"--smush-placeholder-width: 400px; --smush-placeholder-aspect-ratio: 400\/164;width: 400px;\" data-src=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/01-3.jpg\" alt=\"| UKing Diamond\" title=\"- UKing Diamond\" data-srcset=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/01-3.jpg 400w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/01-3-300x123.jpg 300w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/01-3-18x7.jpg 18w\" data-sizes=\"(max-width: 400px) 100vw, 400px\" src=\"data:image\/gif;base64,R0lGODlhAQABAAAAACH5BAEKAAEALAAAAAABAAEAAAICTAEAOw==\" \/><\/td><td><br><strong>Surface Finish<\/strong><br><br><strong>\u00b7 <\/strong>Front Surface Roughness:<br> Ra &lt; 30 nm (&lt; 2 nm customizable)<br><br><strong>\u00b7 <\/strong>Back Surface Roughness:<br> 30 nm-2 \u03bcm (etchable, customizable)<br><br>\u00b7 Thickness:0.5-1 mm customizable <br><br><strong>\u00b7<\/strong> TTV: 50 \u03bcm (2 inch) customizable<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Product Details<\/strong><strong><\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">1. Engineered CTE Matching to Prevent Die Cracking<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The ultimate nightmare in packaging Gallium Nitride (GaN) or GaAs chips is the CTE mismatch. Pure copper expands too fast, causing the fragile chip to crack under thermal cycles. Uking\u2019s Copper Diamond materials solve this bottleneck.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">By dispersing high-purity synthetic diamond particles inside a ductile copper matrix, we achieve a stabilized Coefficient of Thermal Expansion of 8.2&nbsp;ppm\/K. This sits perfectly within the thermal expansion safety window of semiconductor substrates, eliminating packaging stress and ensuring your chips survive severe on\/off power cycling without delamination.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">2. Near-Net Shape Fabrication &amp; Superior Machine ability&nbsp;<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">While pure CVD diamond plates offer unrivaled thermal metrics, they are incredibly brittle and notoriously difficult to cut or drill. Our Copper Diamond composites combine the ultra-high heat dissipation of diamond (\u223c1000&nbsp;W\/m\u22c5K) with the excellent machine ability of copper.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">We utilize advanced powder metallurgy infiltration to create near-net shapes with complex mounting holes, steps, and counter bores. With a surface roughness of Ra&lt;1&nbsp;\u03bcm, these components are ready for direct Ni\/Au or Ti\/Pt\/Au metallization and high-reliability eutectic brazing.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Key Features &amp; Material Advantages<\/strong><strong><\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u00b7&nbsp;&nbsp;<strong>High Thermal Throughput:<\/strong>&nbsp;Reaches a thermal conductivity up to <em>1000W\/m.k<\/em>, instantly channeling heat away from localized semiconductor gates.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u00b7&nbsp;&nbsp;<strong>Tailored Low Expansion Profile:<\/strong>&nbsp;Stabilized 8.2 ppm\/K thermal expansion protects fragile electronic components from mechanical fatigue during rapid thermal swings.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u00b7&nbsp;&nbsp;<strong>High Structural &amp; Flexural Toughness:<\/strong>&nbsp;Flexural strength exceeding <em>400MPa<\/em>&nbsp;ensures the baseplates endure harsh mechanical vibrations in automotive and aerospace installations.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u00b7&nbsp;&nbsp;<strong>Excellent Metallization &amp; Soldering Adaptation:<\/strong>&nbsp;Compatible with standard PVD sputtering and plating processes, facilitating seamless wire bonding and component assembly.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img decoding=\"async\" width=\"2560\" height=\"640\" data-src=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Copper-Diamond-CuDiamond-scaled.png\" alt=\"| UKing Diamond\" class=\"wp-image-6319 lazyload\" style=\"--smush-placeholder-width: 2560px; --smush-placeholder-aspect-ratio: 2560\/640;width:1428px;height:auto\" title=\"- UKing Diamond\" data-srcset=\"..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Copper-Diamond-CuDiamond-scaled.png 2560w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Copper-Diamond-CuDiamond-300x75.png 300w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Copper-Diamond-CuDiamond-1024x256.png 1024w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Copper-Diamond-CuDiamond-768x192.png 768w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Copper-Diamond-CuDiamond-1536x384.png 1536w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Copper-Diamond-CuDiamond-2048x512.png 2048w, ..\/..\/..\/..\/index.html\/wp-content\/uploads\/2026\/05\/Copper-Diamond-CuDiamond-18x5.png 18w\" data-sizes=\"(max-width: 2560px) 100vw, 2560px\" src=\"data:image\/gif;base64,R0lGODlhAQABAAAAACH5BAEKAAEALAAAAAABAAEAAAICTAEAOw==\" \/><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\"><strong>Are your high-power RF modules or laser bars suffering from thermal runaway or die cracking due to poor CTE matching?<\/strong><strong><\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Don&#8217;t compromise electronic package reliability with uncalibrated cooling baseplates. With 20 years of MMC manufacturing experience in Henan, China, UKing Diamond delivers precision-engineered Copper Diamond heat sinks for semiconductor thermal management.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Given the precision manufacturing requirements of Cu\/Diamond composites, we offer structured evaluation batches rather than unqualified free samples \u2014 ensuring every test unit meets your exact thermal and dimensional specifications.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Ready to validate Cu\/Diamond thermal performance for your application? Send us your target specifications (length, width, thickness) and we will arrange a prioritized evaluation batch at factory-direct pricing \u2014 with 100% of the sample cost credited toward your first bulk order.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>UKing Diamond&#8217;s factory-direct Cu\/Diamond metal matrix composites (MMC) combine thermal conductivity of 500\u20131000 W\/m\u00b7K with tailored CTE matching, making them ideal heat sink materials for GaN, SiC, RF power, optoelectronic, and advanced semiconductor packaging applications.<\/p>\n","protected":false},"featured_media":6130,"menu_order":0,"template":"","cxb_product_category":[18],"cxb_product_tag":[],"class_list":["post-5821","cxb_products","type-cxb_products","status-publish","has-post-thumbnail","hentry","cxb_product_category-diamond-copper-composite"],"_links":{"self":[{"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_products\/5821","targetHints":{"allow":["GET"]}}],"collection":[{"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_products"}],"about":[{"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/types\/cxb_products"}],"version-history":[{"count":8,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_products\/5821\/revisions"}],"predecessor-version":[{"id":6320,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_products\/5821\/revisions\/6320"}],"wp:featuredmedia":[{"embeddable":true,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/media\/6130"}],"wp:attachment":[{"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/media?parent=5821"}],"wp:term":[{"taxonomy":"cxb_product_category","embeddable":true,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_product_category?post=5821"},{"taxonomy":"cxb_product_tag","embeddable":true,"href":"..\/..\/..\/..\/index.html\/wp-json\/wp\/v2\/cxb_product_tag?post=5821"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}