Uking Diamond’s Single-Crystal Diamond plates are grown via state-of-the-art Microwave Plasma Chemical Vapor Deposition (MPCVD). Free from grain boundaries and binder metals, these pure carbon crystal lattices deliver isotropic thermal transport and optical perfection for critical high-tech frontiers:

GaN HEMT & High-Frequency RF Devices: Acts as the submount directly under the active channels of GaN transistors, reducing thermal resistance to the physical limit and unlocking maximum RF output power density.

High-Power Laser Optical Windows: Capitalizes on ultra-low absorption coefficients and high refractive index to serve as indestructible transmissive windows for multi-kilowatt CO2 or fiber lasers.

Quantum Computing & Sensors: Provides high-purity crystalline matrices for NV (Nitrogen-Vacancy) center creation, driving advancements in quantum magnetometry and quantum computing chips.

Ultra-Precision Diamond Knives & Tooling: Serves as blanks for ultra-precision turning tools capable of achieving mirror-like surface finishes on non-ferrous metals.

Technical Specifications

Dimensions & Surface Roughness Specifications

1.Standard Dimensions
● Available Sizes: 6×6 mm, 10×10 mm, 15×15 mm, 20×20 mm
● Note: Custom micro-shapes available upon request.
2.Length & Width Tolerance
● ±0.05 mm
3.Thickness Options
● Range: 0.3 mm – 1.0 mm
4.Thickness Tolerance Grades
● Grade A: ±30 μm
● Grade B : ±50 μm
5.Surface Roughness (Ra/Sa) Control
● Grade A (Semiconductor/Optical Grade): Ra < 2 nm, Sa < 2 nm
(Atomic-level smoothness for direct wafer bonding)
● Grade B (Industrial Thermal Grade): Ra < 10 nm, Sa < 10 nm

Product Details

1. Zero-Defect (100) Crystal Orientation for Next-Gen Sputtering

For Tier-1 semiconductor labs, any grain boundary or misorientation means immediate failure. Uking’s MPCVD Single-Crystal Diamond plates feature strict (100) crystal orientation managed within a tight ±3° off-cut angle.

This precise lattice alignment provides an ideal substrate configuration for direct Gallium Nitride (GaN) or Diamond-on-Silicon integration, allowing flawless atomic deposition and preventing threading dislocations during thermal shock.

• Atomic-Level Roughness via White-Light Interferometry

Thermal contact resistance (TCR) can ruin even the best heat sink. To minimize this, Uking deploies specialized chemical-mechanical polishing (CMP) on our Grade A plates, achieving a record-breaking surface roughness of Ra<2 nm and Sa<2 nm (fully verified via 125×125μm white-light interferometry profiling).

This atomic smoothness eliminates gaps during packaging, allowing the single crystal to instantly siphon heat (2200 W/m⋅K) away from the device junction.

Key Features & Value Drivers

• Ultimate Thermal Performance: Boasts a thermal conductivity up to 2200 W/m·K, instantly resolving localized chip bottlenecks.
• Flawless Crystal Lattice: Pure MPCVD homoepitaxial growth yields a single crystal free of boundaries, guaranteeing isotropic heat and light transmission.
• Atomic Bonding Readiness: Sub-2nm surface roughness enables direct eutectic bonding, eliminating the need for thick, heat-trapping thermal interface materials.
• Broadband Optical Mastery: Unrivaled transparency from UV to infrared makes it the ultimate lens choice for multi-kilowatt laser systems and aerospace windows.

Are Your Next-Gen Components Hitting the Thermal Wall?

Whether you are battling massive thermal resistance in sub-micron GaN gates or facing cracking issues in high-power laser windows under intense optical load, standard materials simply cannot keep up.

Stop gambling your hardware architecture on unverified poly-crystalline or low-grade carbon components.

Backed by 20 years of high-pressure and plasma-synthesis metallurgical authority based in Henan, China, Uking Diamond delivers electronic-grade MPCVD Single-Crystal Diamond substrates that push your engineering boundaries to the physical limit.

Exclusive Industrial Evaluation Program

Because single-crystal diamond wafers represent the pinnacle of superhard material value and cleanroom processing costs, we do not distribute unchecked free samples. We engage exclusively in qualified industrial evaluations to ensure our materials reach engineers who truly need them.

Ready to Eliminate Your Thermal Barriers?

Contact our global semiconductor desk today to unlock your Corporate Evaluation Pass.

How it works:

1. Submit Requirements: Provide your standard specs (Size: 6x6mm to 20x20mm), Surface Grade (A or B), and target crystal orientation.
2. Get Prioritized Access: Receive a prioritized test batch of standard (100) single-crystal plates at direct factory wholesale cost.
3. Full Rebate: 100% of the sample evaluation fee is fully credited back to your balance upon your first bulk commercial order.

Uking Diamond’s Aluminum Diamond (Al/Diamond) materials represent the pinnacle of lightweight thermal engineering. By high-pressure infiltrating molten aluminum alloy into a dense synthetic diamond skeleton, we produce customized components that exhibit high structural stability and excellent machine ability:

• Aerospace & Satellite Electronics: Delivers mission-critical cooling for payload transponders and radar systems where every gram of weight reduction drastically lowers launch costs.
• 5G/6G Macro Base Stations: Serves as high-efficiency thermal spreaders for remote radio heads (RRH) and MIMO antenna arrays, enduring harsh outdoor environmental swings.
• Automotive Power Inverters: Protects IGBT and SiC power modules in electric vehicle drive trains from high-temperature failures under aggressive acceleration cycles.
• High-Speed Optoelectronics & Transceivers: Provides laser-flat, low-expansion mounting sub mounts for 400G/800G optical communication chips.

Technical Specifications

Product Details

1. The Ultimate Weight-to-Performance Ratio for Aerospace

In advanced aerospace and mobile defense systems, using heavy copper heat sinks is a liability. Uking’s Aluminum Diamond composites change the game.

Boasting a density of just 3.1 – 3.5 g/cm3 (virtually identical to standard aluminum but with a thermal conductivity up to 950 W/m⋅K), these plates allow system architects to maximize continuous RF power output without exceeding the critical payload mass restrictions.

• Thermal Shock Immunity & High Temperature Survival

Electronic systems utilizing GaN or silicon devices often face harsh thermal cycles. Our Al/Diamond plates are engineered to withstand these extreme conditions with superior stability:

-Exceptional Thermal Stability: Maintains over 90% of initial flexural strength even at continuous operating temperatures up to 500°C.

-Superior Internal Integrity: Utilizes precise vacuum pressure metallurgical processing to effectively prevent voids and catalyst pooling (e.g., cobalt) at internal boundaries.

-Tailored CTE Matching: Features an engineered low Coefficient of Thermal Expansion (6.5–11.6 ppm/K) that aligns perfectly with semiconductor die expansion curves. This prevents micro-delamination, solder cracking, and sudden module failure.

Key Features & Value Drivers

Ultra-Lightweight Thermal Defense: Delivers copper-grade thermal throughput at one-third of the weight, maximizing payload efficiency.

Tailored Low Thermal Expansion: Seamlessly scales from 6.5 to 11.6 ppm/K via structural composition tweaks, eliminating mechanical packaging fatigue.

• Extreme Thermal Stability: Retains high structural integrity and rigid strength under 500°C high-stress environments.
• High Complex Shape Adaptation: Easily mass-manufactured into custom complex geometries with counterbores and multi-level steps according to your drawings.

Are your aerospace transponders or high-frequency 5G modules bottlenecked by the extreme weight of copper heat sinks or catastrophic CTE cracking?

Stop compromising your mobile electronics with heavy, outdated thermal spreaders. Backed by 20 years of advanced metal-matrix composite (MMC) synthesis expertise in Henan, China, Uking Diamond delivers ultra-lightweight Aluminum Diamond heat sinks that elevate system reliability.

Because every Al/Diamond plate requires high-purity diamond lattices processed under strict vacuum-pressure infiltration controls, we do not distribute unchecked free samples. We focus entirely on high-intent industrial evaluation.

Ready to cut weight and maximize your ROP? Contact our engineering team today with your target standard specifications (Length, Width, Thickness) and configuration limits. We will instantly open your Corporate Evaluation Pass: obtain your prioritized evaluation trial batch of standard Al/Diamond plates at direct factory wholesale pricing, with 100% of the sample evaluation cost fully credited back to your account upon your first bulk commercial order.

Uking Diamond’s Copper Diamond (Cu/Diamond) composite materials are premier metal-matrix thermal solutions. Unlike brittle pure diamond plates, these composites can be pressed into near-net shapes or machined into complex profiles, making them highly adaptive for multi-component surface metallization and advanced brazing/soldering lines:

• High-Power Semiconductor Lasers: Serves as submounts for high-wattage laser diodes and laser bars, effectively relieving localized heat localization.
• Radar TR Modules & Electronic Countermeasures: Provides mass-producible, vibration-resistant thermal baseplates for military and commercial radar systems.
• Aerospace Thermal Management: Delivers robust, radiation-immune heat dissipation brackets for deep-space communication hardware.
• IGBT & Power Electronic Modules: Acts as the critical interface material in electric vehicles and high-voltage traction inverters to prevent severe thermal cycling fatigue.

Technical Specifications

DIMENSIONS & SURFACE FINISH

Available Forms · Plate,bar,customized shapes · Hole, slot, notch processing available · Surface metalization and bonding treatment available

Surface Finish · Front Surface Roughness: Ra < 30 nm (< 2 nm customizable) · Back Surface Roughness: 30 nm-2 μm (etchable, customizable) · Thickness:0.5-1 mm customizable · TTV: 50 μm (2 inch) customizable

Product Details

1. Engineered CTE Matching to Prevent Die Cracking

The ultimate nightmare in packaging Gallium Nitride (GaN) or GaAs chips is the CTE mismatch. Pure copper expands too fast, causing the fragile chip to crack under thermal cycles. Uking’s Copper Diamond materials solve this bottleneck.

By dispersing high-purity synthetic diamond particles inside a ductile copper matrix, we achieve a stabilized Coefficient of Thermal Expansion of 8.2 ppm/K. This sits perfectly within the thermal expansion safety window of semiconductor substrates, eliminating packaging stress and ensuring your chips survive severe on/off power cycling without delamination.

2. Near-Net Shape Fabrication & Superior Machine ability 

While pure CVD diamond plates offer unrivaled thermal metrics, they are incredibly brittle and notoriously difficult to cut or drill. Our Copper Diamond composites combine the ultra-high heat dissipation of diamond (∼1000 W/m⋅K) with the excellent machine ability of copper.

We utilize advanced powder metallurgy infiltration to create near-net shapes with complex mounting holes, steps, and counter bores. With a surface roughness of Ra<1 μm, these components are ready for direct Ni/Au or Ti/Pt/Au metallization and high-reliability eutectic brazing.

Key Features & Material Advantages

·  High Thermal Throughput: Reaches a thermal conductivity up to 1000W/m.k, instantly channeling heat away from localized semiconductor gates.

·  Tailored Low Expansion Profile: Stabilized 8.2 ppm/K thermal expansion protects fragile electronic components from mechanical fatigue during rapid thermal swings.

·  High Structural & Flexural Toughness: Flexural strength exceeding 400MPa ensures the baseplates endure harsh mechanical vibrations in automotive and aerospace installations.

·  Excellent Metallization & Soldering Adaptation: Compatible with standard PVD sputtering and plating processes, facilitating seamless wire bonding and component assembly.

Are your high-power RF modules or laser bars suffering from thermal runaway or die cracking due to poor CTE matching?

Don’t compromise electronic package reliability with uncalibrated cooling baseplates. With 20 years of MMC manufacturing experience in Henan, China, UKing Diamond delivers precision-engineered Copper Diamond heat sinks for semiconductor thermal management.

Given the precision manufacturing requirements of Cu/Diamond composites, we offer structured evaluation batches rather than unqualified free samples — ensuring every test unit meets your exact thermal and dimensional specifications.

Ready to validate Cu/Diamond thermal performance for your application? Send us your target specifications (length, width, thickness) and we will arrange a prioritized evaluation batch at factory-direct pricing — with 100% of the sample cost credited toward your first bulk order.

The Ultimate Thermal Management Solution for Next-Gen High-Power Electronics

Through advanced Chemical Vapor Deposition (CVD) synthesis under rigorous microwave plasma (MPCVD) parameter control, Uking Diamond delivers polycrystalline diamond heat sinks with premium isotropic thermal conductivity surpassing 1200 to 2000 W/m·K.

Engineered to eliminate localized hotspots and thermal run-away, our micro-discs and submounts serve as the critical foundation for high-power optoelectronics, wide-bandgap semiconductors (GaN/SiC), RF microwave amplifiers, and aerospace radar modules.

PRODUCT SPECIFICATIONS

Laser-Ready Surface Roughness: Front-side specialized polishing down to Ra < 2nm    ensuring atomic-level intimacy and zero thermal contact resistance TCR  during eutectic bonding or sputtering. Back-side chemical etched or polished up to Ra 30–100nm  matching custom dielectric metallization layout.

Total Thickness Variation:

Strictly calibrated TTV  < 5μm (across 2-inch wafers) to guarantee uniform pressure distribution during device integration, significantly increasing package yield rates.

DIMENSIONS & SURFACE CHARACTERISTICS

Standard Sizes ● Optical window flatness(front): Ra<30nm (< 2nm customizable) ● Back surface roughness (front):30-100nm (customizable)(measured area 12Sx125μm) ● Back surfaceroughness(back):30nm-2um (customizable)(measured area 125×125μm) ● TTV:50μm(2 inch) customizable Thickness:<300um(2 inch) customizable

Shape Options Available in multiple shapes: ●Custom shapes and sizes are availablle according to customer drawings.

High-Power Laser Diodes (LD) & Modules

Prevents wavelength drift and power degradation in multi-watt industrial laser bars by facilitating ultra-fast lateral heat spreading directly beneath the cavity facet.

Wide-Bandgap Semiconductors (GaN on Diamond / SiC)

• Unlocks the true power density potential of Gallium Nitride (GaN) and Silicon Carbide (SiC) RF power amplifiers by dropping junction temperatures by up to 50 ℃

• RF, Microwave & 5G/6G Infrastructure
• Enhances signal integrity and Mean Time Between Failures (MTBF) in solid-state power amplifiers (SSPA) operating under extreme continuous wave (CW) conditions.

·   Aerospace & High-Reliability Electronics

• Delivers radiation-hardened, corrosion-resistant thermal defense matrices that endure severe thermal shock profiles in deep-space and defense missions.

Eliminate Downtime & Submount Failures. Unlock Your Engineering Validation Pass.

Every high-performance CVD diamond thermal spreader is born in our state-of-the-art microwave plasma synthesis grid, verified by non-destructive thermal diffusivity testing. Because premium diamond wafers represent a high-value engineering investment, we do not distribute unchecked free handouts. We focus on absolute technical alignment.

Ready to validate the performance leap on your assembly line? Contact our global engineering desk today with your standard configuration requirements (Square, Rectangle, Round, Hexagon, or Special Shapes) and your target thermal conductivity grade (TC1200-TC2000).

While we do not offer free samples, we will wave all metallization engineering fees and custom cutting design charges for verified qualified corporate clients. Secure an Engineering Trial Pass today to receive your evaluation batch at factory-direct wholesale cost, with 100% of the sample evaluation fee fully credited back to your account upon your first bulk commercial order.

Uking Diamond’s ultra-tough mining PDC cutters utilize a structurally optimized structural combination that transforms linear impact forces into manageable shear stress. This delivers long tool life, high Rate of Penetration (ROP), and predictable wear profiles across volatile geological and mining operations:

Coal Mining & Roof Bolting: Provides ultra-stable, micro-chipping resistant cutting edges for continuous roof bolting bits and rotary drilling in dense coal measures.

Blast-Hole Drilling: Extends footage through highly abrasive sandstone, shale, and limestone strata without thermal edge degradation.

Tunneling & TBM Disc Inserts: Absorbs extreme cyclic shock and heavy impact loads during continuous granite, quartz, and mixed-face geotechnical tunneling.

Down-The-Hole (DTH) & Geothermal Drilling: Replaces fragile tungsten carbide inserts in volatile environments, drastically reducing bit-pulling frequency and total drilling costs per foot.

Product Categorization & Specs

Standard Manufacturing Parameters)

• Sintering Technology: Ultra-High Pressure High-Temperature (HPHT) processing, managing precise temperature gradients to eliminate micro-cracks.
• Interface Architecture: Advanced 3D Non-Planar Wave Interface that redistributes radial shear stress, amplifying the mechanical bond strength by up to 45%.
• Standard Sizing Matrix: Available in standard industry diameters: 10mm, 13mm, 16mm, and 19mm (including standard flat configurations and tailored shaped buttons).

Product Details

1. The Science of the 3D Non-Planar Wave Interface

The most common disaster for a mining drill bit is matrix delamination—where the diamond layer delaminates or strips off from the tungsten carbide base due to severe rock impact. Uking Diamond completely neutralizes this risk.

Our mining PDC cutters feature a patented 3D non-planar wave interface structural combination between the polycrystalline diamond layer and the hard alloy substrate. This advanced geometric transition increases the interfacial binding surface area, dampens lateral vibration stress, and prevents catastrophic layer peeling when your drill bit slams into unexpected hard rock inclusions.

2. Advanced Performance Test Lab Validation

Every single production batch of Uking’s mining PDC cutters undergoes strict quality verification inside the most advanced PCD performance test lab in China. We do not guess quality—we measure it.

Our technical group subjects the cutters to rigorous continuous drop-weight impact profiling (TI/TTI verification) and severe vertical turret lathe (VTL) granite scraping tests. This ensures that every cutter delivered to your factory possesses high wear resistance and uniform diamond particle distribution, maximizing your continuous footage before the next maintenance cycle.

Key Value Propositions

Superior Edge Retention: The fine-tuned synthetic diamond micro-grain matrix delivers exceptional sharpness, preventing edge rounding and maintaining optimal ROP in hard rock.

Elimination of Catastrophic Delamination: The cross-linked non-planar interface ensures 100% mechanical binding integrity, protecting your bits from sudden Down-The-Hole failure.

High Structural Stability Under Thermal Shock: Optimized thermal stability limits allow the cutters to endure the rapid heating and cooling cycles common in dry or water-flushed mining environments.

Perfect Drop-in Standard Specifications: Fully compatible with international standard mining tooling dimensions, ensuring seamless assembly into your existing coal bit or roof bolt production lines.

Are your mining bits losing ROP or suffering from premature cutter delamination in tough geological formations?

Don’t compromise your production throughput with unverified, generic diamond inserts that increase downtime and drive up total cost-per-foot. Backed by 20 years of superhard material metallurgical expertise in Henan, China, Uking Diamond delivers field-proven mining PDC cutters validated under ruthless laboratory stress testing.

Because high-grade mining PDC cutters represent a premium engineering investment, we do not distribute unchecked free samples. We focus entirely on high-efficiency commercial evaluation.

Unlock your factory-direct testing advantage today. Contact our global sales squad with your standard cutter specifications (10mm, 13mm, or 16mm) and your target rock formation profile (e.g., abrasive coal measures or granite tunneling). We will immediately issue our Corporate Validation Pass: secure a dedicated evaluation trial batch of our advanced high-impact standard cutters at direct factory wholesale cost, with 100% of the sample cost fully credited back to your balance upon your first bulk commercial order.

Traditional roller cone bits break rocks through primitive crushing, which consumes immense energy and limits Rate of Penetration (ROP). Uking’s premium Oil & Gas PDC cutters revolutionize drilling dynamics by utilizing a highly efficient shearing and scraping action, achieving superior rock destruction metrics across volatile geological formations:

Soft to Medium Strata: Facilitates aggressive cutting edge exposure, enabling maximum ROP and ultra-smooth continuous chip evacuation.

Hard & Highly Abrasive Formations : Deploys high-density diamond matrix grids that withstand brutal friction without catastrophic thermal wear.

Complex Interceded Formations: Perfectly absorbs volatile cyclic loading and impact spikes when transitioning between varying rock hardness zones, preventing cutter micro-chipping.

Product Categorization & Technical Specs

Standard Configurations)

• Manufacturing Process: High-Pressure High-Temperature (HPHT) synthesis utilizing China’s most advanced cubical press technology.
• Substrate Bond Interface: Patented Serrated Non-Planar Interface (NPI) designed to redistribute radial residual stress and amplify shear bond strength by 40%.
• Standard Outer Diameters : 13mm, 16mm, 19mm (Custom dimensions, tailored heights, and non-planar face inserts available on demand).

Product Engineering

1. The Science of the Serrated Substrate Interface

The fatal vulnerability of generic PDC cutters is delamination—where the diamond layer shears off from the tungsten carbide base due to extreme residual stress during cooling. Uking Diamond eliminates this failure vector.

Our cutters utilize a highly engineered serrated structural combination between the polycrystalline diamond layer and the hard alloy substrate. This non-planar pattern dramatically increases the binding surface area, absorbs localized impact spikes, and guarantees exceptional structural stability during heavy-duty directional or interrupted drilling.

2. Advanced Performance Test Lab & Deep-Well Thermal Immunity

Uking Diamond operates the most advanced PCD performance test lab in China, dedicated explicitly to R&D for the Oil & Gas drilling and mining industries. Our testing protocol includes rigorous impact drop-tests, continuous vertical turret lathe (VTL) wear profiling, and non-destructive ultrasonic C-scan imaging to verify 100% internal binding integrity.

To conquer the extreme downhole temperatures >750℃ generated by dry friction in deep wells, our high-performance cutters undergo an advanced chemical leaching process to remove thermal-expanding residual cobalt from the critical cutting tip zone. This creates a cobalt-free diamond shell that preserves diamond lattices, delays thermal graphitization, and keeps your drill bit running longer without premature pulling runs.

Key Value Propositions

• Unrivaled Wear & Impact Synergy: Delivers the industry’s finest balance between micro-hardness and impact toughness (TI/TTI), ensuring continuous ROP without cutter cracking.
• Patented Stress-Relieved Bonding: The cross-linked serrated geometry completely eliminates catastrophic delamination at the diamond-carbide interface.
• Superior Thermal Stability: Advanced acid-leaching technology safeguards the cutting edge from thermal degradation under extreme dry friction.
• Tailored Geometric Customization: Fully capable of designing customized inserts, specialized shaped cutters (ridge, spherical, conical), and custom profiles matching your proprietary bit body layouts.

Ready to Benchmark Your Bit Footage Against Premium Industry Standards? Apply for an Engineering Validation Pass.

At Uking Diamond, we support global drilling exploration with 20 years of high-pressure high-temperature (HPHT) metallurgical authority. Because premium-grade Oil & Gas PDC cutters are high-capital production assets, we do not distribute unchecked free samples. We treat downstream field validation with the absolute technical rigor your operation demands.

Don’t let unstable cutter wear compromise your Rate of Penetration (ROP). Contact our engineering desk today with your target formation profiles (e.g., highly abrasive sandstone or interbedded hard rock) and standard cutter specifications (13mm, 16mm, or 19mm). We will instantly unlock our Corporate Validation Pass: obtain a dedicated trial batch of our advanced non-planar interface or acid-leached standard cutters at direct factory wholesale cost, with 100% of the evaluation sample fee fully credited back to your account upon your first bulk commercial order.

Parameters

Picture	Model	Diameter(±0.03)(mm)	Height(±0.05)(mm)	Diamond layer thickness(±0.2)(mm)
	1304	13.30	4.5	1.5
	1308	13.44	8.0	2.1
	1313	13.44	13.20	2.1
	1608	16.00/15.88	8.00	2.1
	1610	16.00/15.88	10.00	2.1
	1613	16.00/15.88	13.20	2.1
	1913	19.05	13.20	2.1
	1916	19.05	16.00	2.1

Uking Diamond’s ultra-dense Polycrystalline Diamond (PCD) tool blanks provide optimized cutting vectors for extreme continuous machining, heavily adopted in global supply chains for:

High-Silicon Aluminum Alloys: Critical automotive engine blocks, pistons, and aerospace turbine housings (e.g., Al-Si grades with >12% Si content).

Advanced Composites: Clean, burr-free milling of Carbon Fiber Reinforced Plastics (CFRP), Glass Fiber Composites (GFRP), and honeycombs.

Abrasive Woodworking: High-speed profiling of MDF, HDF, particle boards, and laminated hardwood without edge chipping.

Non-Metallics & Ceramics: Machining of green ceramics, graphite electrodes, sintered plastics, and abrasive rubber compound components.

Technical Specifications & Grain Selection

Geometric Configurations

Material Architecture: Polycrystalline Diamond Layer permanently bonded to a rigid Tungsten Carbide (WC) support substrate.

Available Outer Diameters: Ø10 mm up to Ø65 mm (Standard stock includes Ø50mm, Ø60mm, and laser pre-cuts).

PCD Layer Depth Options : 0.2mm, 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm (Fully customizable).

Pre-Cut Geometries: Triangles, rectangles, squares, semi-circles, pentagons, and complex tailored profiles via EDM/Laser.

Product Details

1. Ultra-Dense HPHT Sintering Grid & Zero Delamination

Generic PCD blanks often suffer from premature layer delamination (the diamond separating from the carbide base) during laser-cutting or intense interrupted cutting shocks. At Uking Diamond, our blanks are processed under multi-gigapascal Ultra-High Pressure and High Temperature (HPHT) environments.

Through precise cobalt-solvent catalyst infiltration control, we achieve an absolute chemical-metallurgical bond at the interface. The diamond-to-diamond (D−D bonding) mesh grid combined with the carbide support layer guarantees excellent impact resistance, eliminating structural delamination even under high-feed continuous tooling lines.

2. Advanced Micro-Morphology for Extended Tool Lifespan

Our proprietary diamond particle grading tech eliminates uneven catalyst pooling inside the PCD matrix. This translates to an ultra-homogeneous layer featuring excellent thermal conductivity (∼500–1000 W/m⋅K).

When running high-speed CNC machinery, heat is rapidly evacuated from the critical cutting tip zone, preventing thermal graphitization of the diamond. Your factory gets stable edge retention, zero burrs on workpiece surfaces, and a massive reduction in tool change frequency compared to traditional carbide or HSS tooling.

Key Features

Flawless Cutting Edge Integrity: Superior micro-structural homogeneity allows tool manufacturers to achieve razor-sharp cutting profiles via laser or wire-EDM without micro-chipping.

Unmatched Thermal Graphitization Resistance: Superior heat dissipation capacity preserves the diamond lattice structure even under intense operational limits, enabling aggressive cutting speeds.

Highly Configurable Substrate Depth: Tailored combinations of carbide backing thickness and PCD depth to withstand specific vibration frequencies in automated milling centers.

Rigorous Non-Destructive Ultrasonic C-Scan Inspection: Every single disc is mapped via ultrasonic C-scan to ensure 100% internal bonding consistency before shipping.

Ready to Eliminate Premature Tool Failure? Secure Your Risk-Free Test Sample Today!

At Uking Diamond, we back our multi-modal sintering technology and nano-mirror finishing with 20 years of global engineering authority. We don’t expect you to take our word for it—we want you to experience the performance leap on your own production line, 100% risk-free.

Send us your engineering drawings (PDF/.DXF/.STEP) and machine parameters right now. Our technical team will review your geometric tolerances and allocate a Free Tailored Sample Batch matching your exact tensile strength and processing speed requirements.

Uking Diamond’s SSCD (also abbreviated as SMCD, MCD, or Mono-Diamond) drawing dies are engineered under strictly controlled HPHT (High Pressure High Temperature) conditions. They are the premier choice for zero-defect continuous drafting of ultra-fine and fine filaments:

Fine Steel Wire Industry : High-tensile steel cords, tire cords, saw wires, and precision stainless steel wires.

Electronics & Photovoltaics: Ultra-fine copper wires, tinned copper wires, and advanced semiconductor cutting wires.

Precious Metal Micro-Drawing: Fine gold, silver, and platinum lines where stable geometric tolerances are critical.

Refractory Metal Filaments: High-temperature drawing of tungsten, molybdenum, and welding alloy wires.

Technical Specifications

Product Details

1. The Power of Controlled (111) Crystal Orientation

Every single crystal diamond blank selected for Uking’s SSCD drawing dies is synthesized under extreme, multi-stage calibrated laboratory environments. We strictly align the internal diamond core to the (111) crystal face orientation.

Because the (111) plane represents the atomic structure with the absolute highest packing density and hardness in the diamond lattice, our SSCD dies exhibit isotropic, predictable wear behavior. This eliminates the premature structural chipping common in poorly oriented single crystals, ensuring that your manufacturing line achieves consistent, long-run production campaigns.

2. Elimination of Defects for Stable, Zero-Error String-Up

Traditional or secondary-grade single-crystal tools often harbor microscopic internal stresses or volatile nitrogen impurity clusters that rupture under heavy drawing tension. Uking’s advanced laser-scanning inspection filters out any blanks with trace cracks or inclusion vectors.

Our proprietary nano-mirror inner channel polishing guarantees a perfectly smooth wire entry zone. This geometric optimization drastically lowers initial friction coefficient, prevents metal shaving generation, facilitates immediate string-up, and keeps the wire perfectly round even after severe operational mileage.

Key Features

Predictable & Stable Campaign Life: The ultra-high purity and flawless consistency of synthetic mono-crystals make your tooling replacement schedules 100% predictable, cutting unexpected machine downtime.

Flawless Nano-Mirror Surface Finish: Smooth entry and reduction zones eliminate scratching on delicate fine steel or electronics wires, ensuring an elite grade finish.

Exceptional Photothermal Dissipation: The ultra-high thermal conductivity swiftly removes localized frictional heat from the die core during high-speed continuous drawing, preventing premature thermal fatigue expansion.

Uncompromising Geometric Consistency: Manufactured via automated high-precision laser profiling, ensuring every single die in your bulk order delivers identical micron-level precision.

Are you facing unexpected wire breakage or diameter expansion in your fine steel wire or copper alloy drawing lines?

As a specialized superhard material and diamond die pioneer based in Henan, China, Uking Diamond doesn’t just sell standard tools—we engineer customized reduction angles, bearing lengths, and entry configurations according to your specific wire tensile strength and machine speed parameters.

Contact our global engineering group today to get a factory-direct wholesale quote or apply for our Sample Evaluation Program. Let’s upgrade your micro-wire drafting efficiency together!

While ultra-hard diamond dies excel in fine-microwire applications, Uking’s premium cemented carbide (tungsten steel) dies deliver the most economical, high-tonnage solution for heavy-duty drawing pipelines, specifically optimized for:

Steel Wire Industry: High-carbon steel wire, structural steel lines, welding wires, and spring steel manufacturing.

Large-Diameter Cable Stranding: Drafting, bundling, and twisting of bulk power cables and infrastructure wiring grids.

Non-Ferrous Heavy Drafting : Large-size aluminum rods, copper bars, and diverse hard alloy tube or rod profiling.

High-Loss High-Impact Operations: Pre-drawing stages where initial wire surfaces are rough, uneven, or scale-heavy, acting as a crucial defense tool before precision diamond finishing.

Technical Specifications

Product Details

1. Premium Metallurgical Matrix & Optimized Cobalt Balance

Uking Diamond’s tungsten carbide (TC) drawing dies are manufactured utilizing sub-micron tungsten carbide particles seamlessly bonded in a highly optimized cobalt matrix. By strictly regulating the WC-to-Cobalt ratio, our metallurgical engineering ensures an optimal balance between exceptional wear resistance (hardness) and high fracture toughness.

Unlike generic tungsten steel modules on the market, our sintered compacts feature zero internal porosity, allowing the inner geometry to withstand intense radial pressures and extreme high-temperature environments up to 2800 °C without mechanical deformation.

2. The Ideal Economical Alternative for Structural High-Loss Lines

In multi-stage industrial wire drawing, using expensive PCD or ND dies for initial large-diameter or abrasive high-carbon steel wire drawing can be financially non-viable.

Uking’s cemented carbide dies provide a heavy-duty, low-cost operating framework. Featuring low energy consumption and an exceptionally low coefficient of friction under standard powder/dry lubricants, these dies handle highly abrasive metal processing with prolonged continuous stability, ensuring a predictable tool-change schedule and significantly lowering the cost per ton of finished metal.

Key Features

Extreme Shock & Impact Resistance: The robust cobalt-bonded cement matrix effortlessly absorbs sudden load spikes and vibrations common in high-speed steel cable twisting and structural wire drawing.

Massive Diameter Capabilities (Up to 45mm): Precision-engineered core geometries across the entire 0.1mm to 45mm spectrum, accommodating massive industrial conductors and heavy alloy tubing.

Outstanding Corrosion & Wear Immunity: High chemical inertness resists acidic or alkaline additives within generic heavy drawing lubricants, avoiding premature chemical erosion and scaling.

Advanced Internal Mirror Polish: Every die hole undergoes rigorous diamond-slurry finish polishing, achieving an ultra-smooth profile that minimizes metal shaving buildup and guarantees a clean surface on bulk conductors.

Are you trying to minimize tooling costs for your high-tonnage carbon steel wire or heavy cable stranding lines?

Backed by 20 years of superhard material metallurgical expertise in Henan, China, Uking Diamond provides customized TC die solutions with precise grade allocations matching your metal hardness and continuous drawing speed.

Contact our technical sales team today to request our factory price list, explore custom specifications from 0.1mm up to 45mm, or receive a quick trial quote. Let us optimize your production budget without sacrificing geometric accuracy!

Uking Diamond’s high-accuracy ND wire drawing dies are the industry standard for ultra-high-speed continuous drafting of premium micrometer-range filaments, specifically optimized for:

Semiconductor & Electronics: Ultra-fine Gold (Au) wire, Silver (Ag) wire, and Platinum (Pt) bonding wires.

Precious & Rare Metals: Pure Medical-grade Stainless Steel, Molybdenum (Mo), and Hot Tungsten (W) filaments.

High-Conductivity Conductors: Superfine Copper (Cu), Tinned Copper, Aluminum (Al), and specialized Copper-Aluminum Alloys.

Aerospace & Precision Instruments: Fine-line alloys requiring absolute circularity (zero ovality) over long-distance continuous extrusion.

Technical Specifications

Product Details

1. The Physics of Type Ia Natural Diamond Blanks

Unlike ordinary synthetic single crystals, the die blanks selected by Uking Diamond are exclusively sourced from premium, stringently inspected Type Ia Natural Diamonds. At the atomic level, these unique diamonds contain a well-regulated concentration of nitrogen impurities (approximately 0.1%).

Crucially, these nitrogen atoms do not exist as isolated impurities; instead, they naturally aggregate into small, synchronized atomic clusters (platelets). This specific aggregate structure acts as an internal crystalline reinforcement matrix. It drastically minimizes the natural cleavage tendency of single-crystal diamonds, providing Uking’s ND dies with exceptional structural toughness, superior photothermal properties, and unrivaled wear resistance.

2. Why Uking ND Dies Outperform Secondary Alternatives

Every natural diamond blank undergoes strict polarizing microscopy polarization tests to completely eliminate internal stress concentrations and micro-fractures before laser drilling and ultrasonic polishing.

Our proprietary nano-level mirror-finishing technology achieves a flawless inner channel surface. This zero-friction geometry prevents line tension spikes, completely eliminates wire scratching or shaving generation, and guarantees that your drawn wire remains perfectly round and geometrically stable even during long-run production campaigns.

Key Features

Unmatched Mirror Surface Finish: Produces a pristine, scratch-free surface on delicate electronic bonding wires, meeting the most critical aerospace and semiconductor quality criteria.

Guaranteed Wire Circularity (Zero Ovality): Even after millions of continuous rotations, the die hole maintains strict concentricity, ensuring the wire remains perfectly round over extended mileages.

Ultimate Thermal Dissipation: High thermal conductivity rapidly dissipates localized frictional heat generated at the reduction angle, preventing wire elongation breakage.

Extreme Wear Resistance for Long Runs: Drastically extends the service campaign lifespan compared to tungsten carbide or synthetic single-crystal dies, making it the most cost-efficient tool for high-value precious metals.

Are you experiencing wire breakage or surface ovality during ultra-fine wire drawing below 0.1mm?

As a leading superhard materials manufacturer based in Henan, China, Uking Diamond offers customized inner geometries (reduction angles and bearing lengths) tailored exactly to your wire tensile strength and machine drafting speed.

Contact our engineering team today to request a factory-direct quote or ask for a test sample (Sample Allocation Program available for verified wire manufacturers). Let’s elevate your micro-wire quality together!

Our CVD nano-diamond coating dies are high-efficiency alternatives to traditional tungsten carbide (TC) tools, widely applied in the global wire and cable industry for:

• Conductor Stranding & Drawing: High-speed shaping of non-ferrous electric lines.
• Conductor Compacting & Tight Pressing: Diameter reduction and flattening of overhead lines.
• Premium Material Processing: Optimized for soft pure aluminum, high-conductivity copper, and heavy-duty aluminum alloy wire profiling.
• High-Voltage (HV) Cable Production: Manufacturing core conductors for medium, high, and ultra-high voltage (UHV) power grids.

Product Details

1. Advanced Sintering & Nano-Surface Morphology

Uking’s stranding and compacting dies utilize advanced Chemical Vapor Deposition (CVD) technology to synthesis a uniform, ultra-dense nano-diamond composite coating directly inside the die core. The surface diamond features a precise grain size engineered at 20-50 nm. This nano-scale morphology creates a near-frictionless, mirror-polished inner channel that allows copper and aluminum conductors to glide smoothly at ultra-high drawing speeds without geometric deviation.

2. Resolving Material Adhesion & Ovality Phenomena

In standard aluminum and copper alloy stranding operations, traditional tungsten carbide (TC) dies fail quickly after just 25-30 km due to rapid thermal wear. This results in severe material adhesion (sticky aluminum/copper buildup), surface scratching, and hole-size expansion (ovality deformation), leading to immediate tool scrapping.

Uking’s CVD nano-diamond coating dies achieve a continuous production length of 1,000 km or more under identical equipment parameters. It completely eliminates material pickup, stabilizes core concentricity, and reduces the frequency of line changes by over 3500%.

3. Enhancing Cable Electrical Insulation & Withstand Voltage Pass Rates

Surface burrs generated during the compacting process are the fatal cause of electrical insulation failure in power cables. Conductor burrs trigger tip discharges (sharp-point discharges) inside the insulation layering of medium and high-voltage (MV/HV) cables, leading to catastrophic test failures.

By utilizing our ultra-low friction nano-diamond dies, the generation of surface burrs and line micro-scratches is completely suppressed. This breakthrough significantly minimizes partial discharge (PD) charges, ensures that special overhead conductors pass the high-voltage corona test, and drastically elevates your factory’s final with stand voltage test pass rate.

Key Features

• 1000KM+ Ultra-Long Campaign Life: Keeps your automated continuous stranding machinery running non-stop, eliminating costly tool-replacement downtime.
• Anti-Adhesion Chemical Isotropism: Zero chemical affinity to soft aluminum and aluminum alloys, completely eliminating material scraping, surface galling, and metal buildup.
• Partial Discharge (PD) Charge Reduction: Drastically smoothens the tight-pressed conductor profile, reducing the localized electric field stress in cables and ensuring premium dielectric safety.
• Energy-Saving Lower Friction: The microscopic diamond-to-metal low friction coefficient lowers drawing bench power consumption, protects pull-blocks, and enhances equipment lifespan.
• Seamless Hardware Retrofitting: Standard geometric control matching international stranding systems, perfectly replacing traditional carbide dies without machine modifications.

Struggling with material adhesion or failed high-voltage withstand tests caused by conductor burrs?

Traditional tungsten carbide dies fail rapidly within 25-30 km when processing soft aluminum or alloy wires, triggering severe sticky aluminum buildup and ovality. More critically, the resulting conductor burrs cause tip discharges, leading to catastrophic partial discharge (PD) test failures in your MV/HV cable lots.

Uking’s CVD nano-diamond coating dies guarantee a continuous campaign life of 1,000+ km, eliminating metal buildup and smoothing the tight-pressed profile to lower localized electric field stress.

Stop wasting money on premature tool scrapping. > Let our technical engineers optimize your compacting line parameters and help you secure a 100% pass rate in stringent corona and voltage tests.

Primary Applications

• Tungsten Carbide Tool Manufacturing: Tool sharpening, flute grinding, and end-face finishing of carbide inserts and drills
• Ceramics & Magnetic Materials: Precision grinding of technical ceramics, ferrite, and silicon components
• Optical & Glass Processing: Optical lenses, sapphire substrates, quartz, and automotive glass
• Others: Thermal spray coatings, PCD/PCBN tool edge preparation, and advanced composite materials

Product Specifications & Models (Standard Examples)

Full customization supported: Grit size, concentration, bond hardness, and hub material (aluminum, steel, or resin) can all be tailored to your machine and workpiece requirements.

1. Core Advantages of Resin Bond Technology

Compared to metal and vitrified bonds, Uking’s resin diamond grinding wheels offer a softer, more flexible bond system with the following key benefits:

• Superior Self-Sharpening: Abrasives shed automatically to expose fresh cutting edges, maintaining consistent sharpness
• Low Grinding Temperature: Significantly reduces workpiece burn, cracking, and residual stress — ideal for heat-sensitive materials
• Excellent Surface Finish: Achieves stable mirror-like finishes of Ra 0.1–0.4 μm
• High Efficiency: Lower grinding forces and reduced vibration, suitable for both wet and dry grinding

2. Uking Proprietary Formulation Advantages

• Premium imported resin matrix combined with high-strength diamond and specialized fillers
• Precisely controlled porosity and bond hardness for balanced wear rate — long life without sacrificing cutting efficiency
• Every wheel undergoes dynamic balancing and laser dimensional inspection to ensure zero vibration at high RPM

Why Choose Uking Diamond Resin Diamond Grinding Wheels?

• Eliminates Burn and Cracks: Low-temperature grinding dramatically reduces scrap rates on precision parts
• Superior Cost Performance: Comparable life to imported wheels at significantly better pricing
• Batch Consistency: Backed by 20 years of superhard materials expertise in Henan, China
• Fast Response: Small-batch customization and quick delivery for urgent maintenance and production needs

Struggling with workpiece burning, inconsistent surface roughness, or short wheel life in your precision grinding operations?

Stop wasting time and money on frequent dressing and scrapped parts with ordinary grinding wheels. Uking Diamond leverages 20 years of technical expertise from China’s superhard materials hub to deliver high-performance, cost-effective Resin Diamond Grinding Wheels to manufacturers worldwide.

 Activate Your Grinding Wheel Validation Program Today Contact our Global Tooling Engineering Division with the following details:

• Required wheel shape and dimensions (e.g., 1A1 150×10×32)
• Workpiece material and current process parameters
• Main challenges (e.g., burning, low efficiency, poor finish)

We will promptly arrange a factory direct trial batch at wholesale pricing. 100% of the trial cost will be credited back toward your first bulk commercial order.

[Contact Uking Diamond Global Tooling Desk for Custom Resin Diamond Grinding Wheel Quote Now]