Uking Diamond’s SSCD (also abbreviated as SMCD, MCD, or Mono-Diamond) drawing dies are engineered under strictly controlled HPHT (High Pressure High Temperature) conditions. They are the premier choice for zero-defect continuous drafting of ultra-fine and fine filaments:

Fine Steel Wire Industry : High-tensile steel cords, tire cords, saw wires, and precision stainless steel wires.

Electronics & Photovoltaics: Ultra-fine copper wires, tinned copper wires, and advanced semiconductor cutting wires.

Precious Metal Micro-Drawing: Fine gold, silver, and platinum lines where stable geometric tolerances are critical.

Refractory Metal Filaments: High-temperature drawing of tungsten, molybdenum, and welding alloy wires.

Technical Specifications

Product Details

1. The Power of Controlled (111) Crystal Orientation

Every single crystal diamond blank selected for Uking’s SSCD drawing dies is synthesized under extreme, multi-stage calibrated laboratory environments. We strictly align the internal diamond core to the (111) crystal face orientation.

Because the (111) plane represents the atomic structure with the absolute highest packing density and hardness in the diamond lattice, our SSCD dies exhibit isotropic, predictable wear behavior. This eliminates the premature structural chipping common in poorly oriented single crystals, ensuring that your manufacturing line achieves consistent, long-run production campaigns.

2. Elimination of Defects for Stable, Zero-Error String-Up

Traditional or secondary-grade single-crystal tools often harbor microscopic internal stresses or volatile nitrogen impurity clusters that rupture under heavy drawing tension. Uking’s advanced laser-scanning inspection filters out any blanks with trace cracks or inclusion vectors.

Our proprietary nano-mirror inner channel polishing guarantees a perfectly smooth wire entry zone. This geometric optimization drastically lowers initial friction coefficient, prevents metal shaving generation, facilitates immediate string-up, and keeps the wire perfectly round even after severe operational mileage.

Key Features

Predictable & Stable Campaign Life: The ultra-high purity and flawless consistency of synthetic mono-crystals make your tooling replacement schedules 100% predictable, cutting unexpected machine downtime.

Flawless Nano-Mirror Surface Finish: Smooth entry and reduction zones eliminate scratching on delicate fine steel or electronics wires, ensuring an elite grade finish.

Exceptional Photothermal Dissipation: The ultra-high thermal conductivity swiftly removes localized frictional heat from the die core during high-speed continuous drawing, preventing premature thermal fatigue expansion.

Uncompromising Geometric Consistency: Manufactured via automated high-precision laser profiling, ensuring every single die in your bulk order delivers identical micron-level precision.

Are you facing unexpected wire breakage or diameter expansion in your fine steel wire or copper alloy drawing lines?

As a specialized superhard material and diamond die pioneer based in Henan, China, Uking Diamond doesn’t just sell standard tools—we engineer customized reduction angles, bearing lengths, and entry configurations according to your specific wire tensile strength and machine speed parameters.

Contact our global engineering group today to get a factory-direct wholesale quote or apply for our Sample Evaluation Program. Let’s upgrade your micro-wire drafting efficiency together!

While ultra-hard diamond dies excel in fine-microwire applications, Uking’s premium cemented carbide (tungsten steel) dies deliver the most economical, high-tonnage solution for heavy-duty drawing pipelines, specifically optimized for:

Steel Wire Industry: High-carbon steel wire, structural steel lines, welding wires, and spring steel manufacturing.

Large-Diameter Cable Stranding: Drafting, bundling, and twisting of bulk power cables and infrastructure wiring grids.

Non-Ferrous Heavy Drafting : Large-size aluminum rods, copper bars, and diverse hard alloy tube or rod profiling.

High-Loss High-Impact Operations: Pre-drawing stages where initial wire surfaces are rough, uneven, or scale-heavy, acting as a crucial defense tool before precision diamond finishing.

Technical Specifications

Product Details

1. Premium Metallurgical Matrix & Optimized Cobalt Balance

Uking Diamond’s tungsten carbide (TC) drawing dies are manufactured utilizing sub-micron tungsten carbide particles seamlessly bonded in a highly optimized cobalt matrix. By strictly regulating the WC-to-Cobalt ratio, our metallurgical engineering ensures an optimal balance between exceptional wear resistance (hardness) and high fracture toughness.

Unlike generic tungsten steel modules on the market, our sintered compacts feature zero internal porosity, allowing the inner geometry to withstand intense radial pressures and extreme high-temperature environments up to 2800 °C without mechanical deformation.

2. The Ideal Economical Alternative for Structural High-Loss Lines

In multi-stage industrial wire drawing, using expensive PCD or ND dies for initial large-diameter or abrasive high-carbon steel wire drawing can be financially non-viable.

Uking’s cemented carbide dies provide a heavy-duty, low-cost operating framework. Featuring low energy consumption and an exceptionally low coefficient of friction under standard powder/dry lubricants, these dies handle highly abrasive metal processing with prolonged continuous stability, ensuring a predictable tool-change schedule and significantly lowering the cost per ton of finished metal.

Key Features

Extreme Shock & Impact Resistance: The robust cobalt-bonded cement matrix effortlessly absorbs sudden load spikes and vibrations common in high-speed steel cable twisting and structural wire drawing.

Massive Diameter Capabilities (Up to 45mm): Precision-engineered core geometries across the entire 0.1mm to 45mm spectrum, accommodating massive industrial conductors and heavy alloy tubing.

Outstanding Corrosion & Wear Immunity: High chemical inertness resists acidic or alkaline additives within generic heavy drawing lubricants, avoiding premature chemical erosion and scaling.

Advanced Internal Mirror Polish: Every die hole undergoes rigorous diamond-slurry finish polishing, achieving an ultra-smooth profile that minimizes metal shaving buildup and guarantees a clean surface on bulk conductors.

Are you trying to minimize tooling costs for your high-tonnage carbon steel wire or heavy cable stranding lines?

Backed by 20 years of superhard material metallurgical expertise in Henan, China, Uking Diamond provides customized TC die solutions with precise grade allocations matching your metal hardness and continuous drawing speed.

Contact our technical sales team today to request our factory price list, explore custom specifications from 0.1mm up to 45mm, or receive a quick trial quote. Let us optimize your production budget without sacrificing geometric accuracy!

Uking Diamond’s high-accuracy ND wire drawing dies are the industry standard for ultra-high-speed continuous drafting of premium micrometer-range filaments, specifically optimized for:

Semiconductor & Electronics: Ultra-fine Gold (Au) wire, Silver (Ag) wire, and Platinum (Pt) bonding wires.

Precious & Rare Metals: Pure Medical-grade Stainless Steel, Molybdenum (Mo), and Hot Tungsten (W) filaments.

High-Conductivity Conductors: Superfine Copper (Cu), Tinned Copper, Aluminum (Al), and specialized Copper-Aluminum Alloys.

Aerospace & Precision Instruments: Fine-line alloys requiring absolute circularity (zero ovality) over long-distance continuous extrusion.

Technical Specifications

Product Details

1. The Physics of Type Ia Natural Diamond Blanks

Unlike ordinary synthetic single crystals, the die blanks selected by Uking Diamond are exclusively sourced from premium, stringently inspected Type Ia Natural Diamonds. At the atomic level, these unique diamonds contain a well-regulated concentration of nitrogen impurities (approximately 0.1%).

Crucially, these nitrogen atoms do not exist as isolated impurities; instead, they naturally aggregate into small, synchronized atomic clusters (platelets). This specific aggregate structure acts as an internal crystalline reinforcement matrix. It drastically minimizes the natural cleavage tendency of single-crystal diamonds, providing Uking’s ND dies with exceptional structural toughness, superior photothermal properties, and unrivaled wear resistance.

2. Why Uking ND Dies Outperform Secondary Alternatives

Every natural diamond blank undergoes strict polarizing microscopy polarization tests to completely eliminate internal stress concentrations and micro-fractures before laser drilling and ultrasonic polishing.

Our proprietary nano-level mirror-finishing technology achieves a flawless inner channel surface. This zero-friction geometry prevents line tension spikes, completely eliminates wire scratching or shaving generation, and guarantees that your drawn wire remains perfectly round and geometrically stable even during long-run production campaigns.

Key Features

Unmatched Mirror Surface Finish: Produces a pristine, scratch-free surface on delicate electronic bonding wires, meeting the most critical aerospace and semiconductor quality criteria.

Guaranteed Wire Circularity (Zero Ovality): Even after millions of continuous rotations, the die hole maintains strict concentricity, ensuring the wire remains perfectly round over extended mileages.

Ultimate Thermal Dissipation: High thermal conductivity rapidly dissipates localized frictional heat generated at the reduction angle, preventing wire elongation breakage.

Extreme Wear Resistance for Long Runs: Drastically extends the service campaign lifespan compared to tungsten carbide or synthetic single-crystal dies, making it the most cost-efficient tool for high-value precious metals.

Are you experiencing wire breakage or surface ovality during ultra-fine wire drawing below 0.1mm?

As a leading superhard materials manufacturer based in Henan, China, Uking Diamond offers customized inner geometries (reduction angles and bearing lengths) tailored exactly to your wire tensile strength and machine drafting speed.

Contact our engineering team today to request a factory-direct quote or ask for a test sample (Sample Allocation Program available for verified wire manufacturers). Let’s elevate your micro-wire quality together!

Our CVD nano-diamond coating dies are high-efficiency alternatives to traditional tungsten carbide (TC) tools, widely applied in the global wire and cable industry for:

• Conductor Stranding & Drawing: High-speed shaping of non-ferrous electric lines.
• Conductor Compacting & Tight Pressing: Diameter reduction and flattening of overhead lines.
• Premium Material Processing: Optimized for soft pure aluminum, high-conductivity copper, and heavy-duty aluminum alloy wire profiling.
• High-Voltage (HV) Cable Production: Manufacturing core conductors for medium, high, and ultra-high voltage (UHV) power grids.

Product Details

1. Advanced Sintering & Nano-Surface Morphology

Uking’s stranding and compacting dies utilize advanced Chemical Vapor Deposition (CVD) technology to synthesis a uniform, ultra-dense nano-diamond composite coating directly inside the die core. The surface diamond features a precise grain size engineered at 20-50 nm. This nano-scale morphology creates a near-frictionless, mirror-polished inner channel that allows copper and aluminum conductors to glide smoothly at ultra-high drawing speeds without geometric deviation.

2. Resolving Material Adhesion & Ovality Phenomena

In standard aluminum and copper alloy stranding operations, traditional tungsten carbide (TC) dies fail quickly after just 25-30 km due to rapid thermal wear. This results in severe material adhesion (sticky aluminum/copper buildup), surface scratching, and hole-size expansion (ovality deformation), leading to immediate tool scrapping.

Uking’s CVD nano-diamond coating dies achieve a continuous production length of 1,000 km or more under identical equipment parameters. It completely eliminates material pickup, stabilizes core concentricity, and reduces the frequency of line changes by over 3500%.

3. Enhancing Cable Electrical Insulation & Withstand Voltage Pass Rates

Surface burrs generated during the compacting process are the fatal cause of electrical insulation failure in power cables. Conductor burrs trigger tip discharges (sharp-point discharges) inside the insulation layering of medium and high-voltage (MV/HV) cables, leading to catastrophic test failures.

By utilizing our ultra-low friction nano-diamond dies, the generation of surface burrs and line micro-scratches is completely suppressed. This breakthrough significantly minimizes partial discharge (PD) charges, ensures that special overhead conductors pass the high-voltage corona test, and drastically elevates your factory’s final with stand voltage test pass rate.

Key Features

• 1000KM+ Ultra-Long Campaign Life: Keeps your automated continuous stranding machinery running non-stop, eliminating costly tool-replacement downtime.
• Anti-Adhesion Chemical Isotropism: Zero chemical affinity to soft aluminum and aluminum alloys, completely eliminating material scraping, surface galling, and metal buildup.
• Partial Discharge (PD) Charge Reduction: Drastically smoothens the tight-pressed conductor profile, reducing the localized electric field stress in cables and ensuring premium dielectric safety.
• Energy-Saving Lower Friction: The microscopic diamond-to-metal low friction coefficient lowers drawing bench power consumption, protects pull-blocks, and enhances equipment lifespan.
• Seamless Hardware Retrofitting: Standard geometric control matching international stranding systems, perfectly replacing traditional carbide dies without machine modifications.

Struggling with material adhesion or failed high-voltage withstand tests caused by conductor burrs?

Traditional tungsten carbide dies fail rapidly within 25-30 km when processing soft aluminum or alloy wires, triggering severe sticky aluminum buildup and ovality. More critically, the resulting conductor burrs cause tip discharges, leading to catastrophic partial discharge (PD) test failures in your MV/HV cable lots.

Uking’s CVD nano-diamond coating dies guarantee a continuous campaign life of 1,000+ km, eliminating metal buildup and smoothing the tight-pressed profile to lower localized electric field stress.

Stop wasting money on premature tool scrapping. > Let our technical engineers optimize your compacting line parameters and help you secure a 100% pass rate in stringent corona and voltage tests.

Our precision-engineered PCD dies are perfectly optimized for high-speed drafting of:

• Ultra-fine Precious Metals: Lead, Zinc, Silver, and Gold wire processing.
• Non-Ferrous Wire: Hard Alloys, Nickel, Brass, and Pure Copper wire drawing.
• High-Tensile Ferrous Metals: Stainless Steel, High Carbon Steel, and Hot Tungsten wire drawing.

Technical Specifications

Product Details

The polycrystalline diamond (PCD) wire drawing dies produced by Uking Diamond utilize top-tier raw materials, including imported premium diamond blanks such as Japanese SUMIDIA and American COMPAX (GE). This guarantees consistent structural integrity and eliminates micro-fractures under high pressure.

Our manufacturing process combines selected diamond micropowder blended with a precise metallic catalyst (cobalt). This mixture is sintered under ultra-high pressure and high-temperature (HPHT) processing conditions. Under these strictly regulated metallurgical controls, the microcrystalline particles form a robust diamond-to-diamond bond (D-D linkage). This gives our PCD dies exceptional hardness, structural isotropy, and high thermal conductivity equivalent to natural single-crystal diamonds (ND).

Because the internal diamond grains are randomly oriented, our PCD microstructures are entirely isotropic. This eliminates directional wear orientation problems, providing significantly higher structural toughness, impact resistance, and prolonged die service life compared to traditional tungsten carbide drawing dies.

Key Features

• Nano-Level Surface Polish: An ultra-fine, mirror-polished inner surface drastically improves wire surface quality, eliminates die-marks, and prevents line scratching.
• Advanced Pre-treatment Technology: Special interface treatments create a super-strong diamond adhesion matrix, preventing blank delamination even during high-impact line adjustments.
•  Extended Tool Life: Exceptional abrasion resistance vastly reduces the frequency of die changes, maximizing your automated continuous drawing machine uptime.
• Ultra High-Speed Drawing: Maximizes wire throughput speeds and elevates production capacity without sacrificing cross-sectional dimensional stability.
• Simplified Coolant & Lubrication: Designed to work smoothly with standard water-based cooling media or generic drawing lubricants, ensuring minimal thermal wear and maintaining clean operating media.

Are you experiencing frequent wire breakage or surface scratching during high-speed drawing below 0.1mm?

Poor inner geometry and unstable diamond blank adhesion are the hidden killers of automated drawing efficiency, causing micro-shavings that degrade your wire finish.

At Uking Diamond, we don’t just supply dies—we design tailored solutions. Our engineering group calibrates precise reduction angles and bearing lengths based on your specific wire tensile strength (MPa) and continuous machine drawing speed.

Get an Instant Factory-Direct Quote Today! > Verified wire and cable manufacturers are eligible to join our Sample Evaluation Program.