Uking Diamond’s ultra-dense Polycrystalline Diamond (PCD) tool blanks provide optimized cutting vectors for extreme continuous machining, heavily adopted in global supply chains for:

High-Silicon Aluminum Alloys: Critical automotive engine blocks, pistons, and aerospace turbine housings (e.g., Al-Si grades with >12% Si content).

Advanced Composites: Clean, burr-free milling of Carbon Fiber Reinforced Plastics (CFRP), Glass Fiber Composites (GFRP), and honeycombs.

Abrasive Woodworking: High-speed profiling of MDF, HDF, particle boards, and laminated hardwood without edge chipping.

Non-Metallics & Ceramics: Machining of green ceramics, graphite electrodes, sintered plastics, and abrasive rubber compound components.

Technical Specifications & Grain Selection

Geometric Configurations

Material Architecture: Polycrystalline Diamond Layer permanently bonded to a rigid Tungsten Carbide (WC) support substrate.

Available Outer Diameters: Ø10 mm up to Ø65 mm (Standard stock includes Ø50mm, Ø60mm, and laser pre-cuts).

PCD Layer Depth Options : 0.2mm, 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm (Fully customizable).

Pre-Cut Geometries: Triangles, rectangles, squares, semi-circles, pentagons, and complex tailored profiles via EDM/Laser.

Product Details

1. Ultra-Dense HPHT Sintering Grid & Zero Delamination

Generic PCD blanks often suffer from premature layer delamination (the diamond separating from the carbide base) during laser-cutting or intense interrupted cutting shocks. At Uking Diamond, our blanks are processed under multi-gigapascal Ultra-High Pressure and High Temperature (HPHT) environments.

Through precise cobalt-solvent catalyst infiltration control, we achieve an absolute chemical-metallurgical bond at the interface. The diamond-to-diamond (D−D bonding) mesh grid combined with the carbide support layer guarantees excellent impact resistance, eliminating structural delamination even under high-feed continuous tooling lines.

2. Advanced Micro-Morphology for Extended Tool Lifespan

Our proprietary diamond particle grading tech eliminates uneven catalyst pooling inside the PCD matrix. This translates to an ultra-homogeneous layer featuring excellent thermal conductivity (∼500–1000 W/m⋅K).

When running high-speed CNC machinery, heat is rapidly evacuated from the critical cutting tip zone, preventing thermal graphitization of the diamond. Your factory gets stable edge retention, zero burrs on workpiece surfaces, and a massive reduction in tool change frequency compared to traditional carbide or HSS tooling.

Key Features

Flawless Cutting Edge Integrity: Superior micro-structural homogeneity allows tool manufacturers to achieve razor-sharp cutting profiles via laser or wire-EDM without micro-chipping.

Unmatched Thermal Graphitization Resistance: Superior heat dissipation capacity preserves the diamond lattice structure even under intense operational limits, enabling aggressive cutting speeds.

Highly Configurable Substrate Depth: Tailored combinations of carbide backing thickness and PCD depth to withstand specific vibration frequencies in automated milling centers.

Rigorous Non-Destructive Ultrasonic C-Scan Inspection: Every single disc is mapped via ultrasonic C-scan to ensure 100% internal bonding consistency before shipping.

Ready to Eliminate Premature Tool Failure? Secure Your Risk-Free Test Sample Today!

At Uking Diamond, we back our multi-modal sintering technology and nano-mirror finishing with 20 years of global engineering authority. We don’t expect you to take our word for it—we want you to experience the performance leap on your own production line, 100% risk-free.

Send us your engineering drawings (PDF/.DXF/.STEP) and machine parameters right now. Our technical team will review your geometric tolerances and allocate a Free Tailored Sample Batch matching your exact tensile strength and processing speed requirements.