Uking Diamond’s Single-Crystal Diamond plates are grown via state-of-the-art Microwave Plasma Chemical Vapor Deposition (MPCVD). Free from grain boundaries and binder metals, these pure carbon crystal lattices deliver isotropic thermal transport and optical perfection for critical high-tech frontiers:

GaN HEMT & High-Frequency RF Devices: Acts as the submount directly under the active channels of GaN transistors, reducing thermal resistance to the physical limit and unlocking maximum RF output power density.

High-Power Laser Optical Windows: Capitalizes on ultra-low absorption coefficients and high refractive index to serve as indestructible transmissive windows for multi-kilowatt CO2 or fiber lasers.

Quantum Computing & Sensors: Provides high-purity crystalline matrices for NV (Nitrogen-Vacancy) center creation, driving advancements in quantum magnetometry and quantum computing chips.

Ultra-Precision Diamond Knives & Tooling: Serves as blanks for ultra-precision turning tools capable of achieving mirror-like surface finishes on non-ferrous metals.

Technical Specifications

Dimensions & Surface Roughness Specifications

1.Standard Dimensions
● Available Sizes: 6×6 mm, 10×10 mm, 15×15 mm, 20×20 mm
● Note: Custom micro-shapes available upon request.
2.Length & Width Tolerance
● ±0.05 mm
3.Thickness Options
● Range: 0.3 mm – 1.0 mm
4.Thickness Tolerance Grades
● Grade A: ±30 μm
● Grade B : ±50 μm
5.Surface Roughness (Ra/Sa) Control
● Grade A (Semiconductor/Optical Grade): Ra < 2 nm, Sa < 2 nm
(Atomic-level smoothness for direct wafer bonding)
● Grade B (Industrial Thermal Grade): Ra < 10 nm, Sa < 10 nm

Product Details

1. Zero-Defect (100) Crystal Orientation for Next-Gen Sputtering

For Tier-1 semiconductor labs, any grain boundary or misorientation means immediate failure. Uking’s MPCVD Single-Crystal Diamond plates feature strict (100) crystal orientation managed within a tight ±3° off-cut angle.

This precise lattice alignment provides an ideal substrate configuration for direct Gallium Nitride (GaN) or Diamond-on-Silicon integration, allowing flawless atomic deposition and preventing threading dislocations during thermal shock.

• Atomic-Level Roughness via White-Light Interferometry

Thermal contact resistance (TCR) can ruin even the best heat sink. To minimize this, Uking deploies specialized chemical-mechanical polishing (CMP) on our Grade A plates, achieving a record-breaking surface roughness of Ra<2 nm and Sa<2 nm (fully verified via 125×125μm white-light interferometry profiling).

This atomic smoothness eliminates gaps during packaging, allowing the single crystal to instantly siphon heat (2200 W/m⋅K) away from the device junction.

Key Features & Value Drivers

• Ultimate Thermal Performance: Boasts a thermal conductivity up to 2200 W/m·K, instantly resolving localized chip bottlenecks.
• Flawless Crystal Lattice: Pure MPCVD homoepitaxial growth yields a single crystal free of boundaries, guaranteeing isotropic heat and light transmission.
• Atomic Bonding Readiness: Sub-2nm surface roughness enables direct eutectic bonding, eliminating the need for thick, heat-trapping thermal interface materials.
• Broadband Optical Mastery: Unrivaled transparency from UV to infrared makes it the ultimate lens choice for multi-kilowatt laser systems and aerospace windows.

Are Your Next-Gen Components Hitting the Thermal Wall?

Whether you are battling massive thermal resistance in sub-micron GaN gates or facing cracking issues in high-power laser windows under intense optical load, standard materials simply cannot keep up.

Stop gambling your hardware architecture on unverified poly-crystalline or low-grade carbon components.

Backed by 20 years of high-pressure and plasma-synthesis metallurgical authority based in Henan, China, Uking Diamond delivers electronic-grade MPCVD Single-Crystal Diamond substrates that push your engineering boundaries to the physical limit.

Exclusive Industrial Evaluation Program

Because single-crystal diamond wafers represent the pinnacle of superhard material value and cleanroom processing costs, we do not distribute unchecked free samples. We engage exclusively in qualified industrial evaluations to ensure our materials reach engineers who truly need them.

Ready to Eliminate Your Thermal Barriers?

Contact our global semiconductor desk today to unlock your Corporate Evaluation Pass.

How it works:

1. Submit Requirements: Provide your standard specs (Size: 6x6mm to 20x20mm), Surface Grade (A or B), and target crystal orientation.
2. Get Prioritized Access: Receive a prioritized test batch of standard (100) single-crystal plates at direct factory wholesale cost.
3. Full Rebate: 100% of the sample evaluation fee is fully credited back to your balance upon your first bulk commercial order.

Uking Diamond’s Aluminum Diamond (Al/Diamond) materials represent the pinnacle of lightweight thermal engineering. By high-pressure infiltrating molten aluminum alloy into a dense synthetic diamond skeleton, we produce customized components that exhibit high structural stability and excellent machine ability:

• Aerospace & Satellite Electronics: Delivers mission-critical cooling for payload transponders and radar systems where every gram of weight reduction drastically lowers launch costs.
• 5G/6G Macro Base Stations: Serves as high-efficiency thermal spreaders for remote radio heads (RRH) and MIMO antenna arrays, enduring harsh outdoor environmental swings.
• Automotive Power Inverters: Protects IGBT and SiC power modules in electric vehicle drive trains from high-temperature failures under aggressive acceleration cycles.
• High-Speed Optoelectronics & Transceivers: Provides laser-flat, low-expansion mounting sub mounts for 400G/800G optical communication chips.

Technical Specifications

Product Details

1. The Ultimate Weight-to-Performance Ratio for Aerospace

In advanced aerospace and mobile defense systems, using heavy copper heat sinks is a liability. Uking’s Aluminum Diamond composites change the game.

Boasting a density of just 3.1 – 3.5 g/cm3 (virtually identical to standard aluminum but with a thermal conductivity up to 950 W/m⋅K), these plates allow system architects to maximize continuous RF power output without exceeding the critical payload mass restrictions.

• Thermal Shock Immunity & High Temperature Survival

Electronic systems utilizing GaN or silicon devices often face harsh thermal cycles. Our Al/Diamond plates are engineered to withstand these extreme conditions with superior stability:

-Exceptional Thermal Stability: Maintains over 90% of initial flexural strength even at continuous operating temperatures up to 500°C.

-Superior Internal Integrity: Utilizes precise vacuum pressure metallurgical processing to effectively prevent voids and catalyst pooling (e.g., cobalt) at internal boundaries.

-Tailored CTE Matching: Features an engineered low Coefficient of Thermal Expansion (6.5–11.6 ppm/K) that aligns perfectly with semiconductor die expansion curves. This prevents micro-delamination, solder cracking, and sudden module failure.

Key Features & Value Drivers

Ultra-Lightweight Thermal Defense: Delivers copper-grade thermal throughput at one-third of the weight, maximizing payload efficiency.

Tailored Low Thermal Expansion: Seamlessly scales from 6.5 to 11.6 ppm/K via structural composition tweaks, eliminating mechanical packaging fatigue.

• Extreme Thermal Stability: Retains high structural integrity and rigid strength under 500°C high-stress environments.
• High Complex Shape Adaptation: Easily mass-manufactured into custom complex geometries with counterbores and multi-level steps according to your drawings.

Are your aerospace transponders or high-frequency 5G modules bottlenecked by the extreme weight of copper heat sinks or catastrophic CTE cracking?

Stop compromising your mobile electronics with heavy, outdated thermal spreaders. Backed by 20 years of advanced metal-matrix composite (MMC) synthesis expertise in Henan, China, Uking Diamond delivers ultra-lightweight Aluminum Diamond heat sinks that elevate system reliability.

Because every Al/Diamond plate requires high-purity diamond lattices processed under strict vacuum-pressure infiltration controls, we do not distribute unchecked free samples. We focus entirely on high-intent industrial evaluation.

Ready to cut weight and maximize your ROP? Contact our engineering team today with your target standard specifications (Length, Width, Thickness) and configuration limits. We will instantly open your Corporate Evaluation Pass: obtain your prioritized evaluation trial batch of standard Al/Diamond plates at direct factory wholesale pricing, with 100% of the sample evaluation cost fully credited back to your account upon your first bulk commercial order.

Uking Diamond’s Copper Diamond (Cu/Diamond) composite materials are premier metal-matrix thermal solutions. Unlike brittle pure diamond plates, these composites can be pressed into near-net shapes or machined into complex profiles, making them highly adaptive for multi-component surface metallization and advanced brazing/soldering lines:

• High-Power Semiconductor Lasers: Serves as submounts for high-wattage laser diodes and laser bars, effectively relieving localized heat localization.
• Radar TR Modules & Electronic Countermeasures: Provides mass-producible, vibration-resistant thermal baseplates for military and commercial radar systems.
• Aerospace Thermal Management: Delivers robust, radiation-immune heat dissipation brackets for deep-space communication hardware.
• IGBT & Power Electronic Modules: Acts as the critical interface material in electric vehicles and high-voltage traction inverters to prevent severe thermal cycling fatigue.

Technical Specifications

DIMENSIONS & SURFACE FINISH

Available Forms · Plate,bar,customized shapes · Hole, slot, notch processing available · Surface metalization and bonding treatment available

Surface Finish · Front Surface Roughness: Ra < 30 nm (< 2 nm customizable) · Back Surface Roughness: 30 nm-2 μm (etchable, customizable) · Thickness:0.5-1 mm customizable · TTV: 50 μm (2 inch) customizable

Product Details

1. Engineered CTE Matching to Prevent Die Cracking

The ultimate nightmare in packaging Gallium Nitride (GaN) or GaAs chips is the CTE mismatch. Pure copper expands too fast, causing the fragile chip to crack under thermal cycles. Uking’s Copper Diamond materials solve this bottleneck.

By dispersing high-purity synthetic diamond particles inside a ductile copper matrix, we achieve a stabilized Coefficient of Thermal Expansion of 8.2 ppm/K. This sits perfectly within the thermal expansion safety window of semiconductor substrates, eliminating packaging stress and ensuring your chips survive severe on/off power cycling without delamination.

2. Near-Net Shape Fabrication & Superior Machine ability 

While pure CVD diamond plates offer unrivaled thermal metrics, they are incredibly brittle and notoriously difficult to cut or drill. Our Copper Diamond composites combine the ultra-high heat dissipation of diamond (∼1000 W/m⋅K) with the excellent machine ability of copper.

We utilize advanced powder metallurgy infiltration to create near-net shapes with complex mounting holes, steps, and counter bores. With a surface roughness of Ra<1 μm, these components are ready for direct Ni/Au or Ti/Pt/Au metallization and high-reliability eutectic brazing.

Key Features & Material Advantages

·  High Thermal Throughput: Reaches a thermal conductivity up to 1000W/m.k, instantly channeling heat away from localized semiconductor gates.

·  Tailored Low Expansion Profile: Stabilized 8.2 ppm/K thermal expansion protects fragile electronic components from mechanical fatigue during rapid thermal swings.

·  High Structural & Flexural Toughness: Flexural strength exceeding 400MPa ensures the baseplates endure harsh mechanical vibrations in automotive and aerospace installations.

·  Excellent Metallization & Soldering Adaptation: Compatible with standard PVD sputtering and plating processes, facilitating seamless wire bonding and component assembly.

Are your high-power RF modules or laser bars suffering from thermal runaway or die cracking due to poor CTE matching?

Don’t compromise electronic package reliability with uncalibrated cooling baseplates. With 20 years of MMC manufacturing experience in Henan, China, UKing Diamond delivers precision-engineered Copper Diamond heat sinks for semiconductor thermal management.

Given the precision manufacturing requirements of Cu/Diamond composites, we offer structured evaluation batches rather than unqualified free samples — ensuring every test unit meets your exact thermal and dimensional specifications.

Ready to validate Cu/Diamond thermal performance for your application? Send us your target specifications (length, width, thickness) and we will arrange a prioritized evaluation batch at factory-direct pricing — with 100% of the sample cost credited toward your first bulk order.

The Ultimate Thermal Management Solution for Next-Gen High-Power Electronics

Through advanced Chemical Vapor Deposition (CVD) synthesis under rigorous microwave plasma (MPCVD) parameter control, Uking Diamond delivers polycrystalline diamond heat sinks with premium isotropic thermal conductivity surpassing 1200 to 2000 W/m·K.

Engineered to eliminate localized hotspots and thermal run-away, our micro-discs and submounts serve as the critical foundation for high-power optoelectronics, wide-bandgap semiconductors (GaN/SiC), RF microwave amplifiers, and aerospace radar modules.

PRODUCT SPECIFICATIONS

Laser-Ready Surface Roughness: Front-side specialized polishing down to Ra < 2nm    ensuring atomic-level intimacy and zero thermal contact resistance TCR  during eutectic bonding or sputtering. Back-side chemical etched or polished up to Ra 30–100nm  matching custom dielectric metallization layout.

Total Thickness Variation:

Strictly calibrated TTV  < 5μm (across 2-inch wafers) to guarantee uniform pressure distribution during device integration, significantly increasing package yield rates.

DIMENSIONS & SURFACE CHARACTERISTICS

Standard Sizes ● Optical window flatness(front): Ra<30nm (< 2nm customizable) ● Back surface roughness (front):30-100nm (customizable)(measured area 12Sx125μm) ● Back surfaceroughness(back):30nm-2um (customizable)(measured area 125×125μm) ● TTV:50μm(2 inch) customizable Thickness:<300um(2 inch) customizable

Shape Options Available in multiple shapes: ●Custom shapes and sizes are availablle according to customer drawings.

High-Power Laser Diodes (LD) & Modules

Prevents wavelength drift and power degradation in multi-watt industrial laser bars by facilitating ultra-fast lateral heat spreading directly beneath the cavity facet.

Wide-Bandgap Semiconductors (GaN on Diamond / SiC)

• Unlocks the true power density potential of Gallium Nitride (GaN) and Silicon Carbide (SiC) RF power amplifiers by dropping junction temperatures by up to 50 ℃

• RF, Microwave & 5G/6G Infrastructure
• Enhances signal integrity and Mean Time Between Failures (MTBF) in solid-state power amplifiers (SSPA) operating under extreme continuous wave (CW) conditions.

·   Aerospace & High-Reliability Electronics

• Delivers radiation-hardened, corrosion-resistant thermal defense matrices that endure severe thermal shock profiles in deep-space and defense missions.

Eliminate Downtime & Submount Failures. Unlock Your Engineering Validation Pass.

Every high-performance CVD diamond thermal spreader is born in our state-of-the-art microwave plasma synthesis grid, verified by non-destructive thermal diffusivity testing. Because premium diamond wafers represent a high-value engineering investment, we do not distribute unchecked free handouts. We focus on absolute technical alignment.

Ready to validate the performance leap on your assembly line? Contact our global engineering desk today with your standard configuration requirements (Square, Rectangle, Round, Hexagon, or Special Shapes) and your target thermal conductivity grade (TC1200-TC2000).

While we do not offer free samples, we will wave all metallization engineering fees and custom cutting design charges for verified qualified corporate clients. Secure an Engineering Trial Pass today to receive your evaluation batch at factory-direct wholesale cost, with 100% of the sample evaluation fee fully credited back to your account upon your first bulk commercial order.